Senior SMT Process Application Engineer (Semiconductor Packaging Focus)(Job Code: 6158)

The hiring company is a global leader and technology innovator in the development and production of thermal system solutions for the electronics and photovoltaics industries . Founded in 1990s and headquartered in Europe, the company specializes in manufacturing energy-efficient equipment for the semiconductor industry

Job Responsibility：

1. Provide technical expertise to customer for reflow processes and other Heating processes in Various Semiconductor Industry.
2. Develop and optimize reflow soldering parameters for semiconductor packaging applications such as silver sintering, clip bonding, SIP modules, and flip chip underfill including troubleshooting.
3. Understand customers’ process pain points and technical language, translating their needs into actionable specifications for the internal R&D team
4. Understand Metallurgy within Semiconductor Field to Understand Soldering behaviors in the related Environment.
5. Contribute test trials for customer including full report.
6. Carry out process training to customer.
7. Support service team during evaluation and demo at customer side.
8. Assist for Semiconductor reflow / Condensing Process and Installation.
9. Work close together with HQ application department for continues improvement.
10. Collect process data from customer to help to improve their processes Reporting.
11. Capable of dealing with customers demonstration and evaluation to the end customers of the famous brands TSMC , ASE and so on

Job Requirement:

1. Bachelor’s or higher in Materials Science and Engineering, Electronic Packaging Technology, Welding Engineering, Mechanical Engineering, or related fields.
2. Minimum 5 years of experience in SMT process engineering or back-end semiconductor packaging processes. Must have direct experience engaging with or serving semiconductor client or working on packing method/solder layout design in Semiconductor industry.
3. Proficient in reflow soldering principles, thermal profile testing and optimization, and voiding control;
4. Familiar with semiconductor packaging workflows (die attach, wire bonding, molding, singulation) and their thermal process requirements.
5. Understanding of critical process control points for power modules (IGBT/SiC), SiP, QFN/BGA, and other package types.
6. Experience in AutoCAD/SolidWorks is a must.
7. Good written, reading and oral English and Chinese.
8. Excellent communication skills, analytical and problem-solving abilities to independently address customer process inquiries;
9. Willingness to travel for customer visits as required.