Application Engineer- Semiconductor Packaging (Job Code: CR6071)

Position: Application Engineer- Semiconductor Packaging

Location: Dongguan, China
Report to: General Manager and CTO (Based at Europe)

Industry: Equipment Supplier for Electronics and Photovoltaic Industries

Company Overview:
We are a European-owned company with more than 20 operational centers globally, boasting a state-of-the-art manufacturing base in Dongguan, Asia. Our commitment to innovation and excellence has positioned us as a leading player in the electronics and photovoltaic sectors. Join us in our Dongguan facility to contribute to groundbreaking solutions that drive the future of technology.

Responsibilities:

1. Provide pre-sales and post-sales technical support to customers, ensuring a deep understanding of their needs and offering tailored solutions.
2. Collaborate closely with the factory general manager, reporting directly on all technical and operational matters.
3. Maintain a dotted-line reporting relationship with the Technical Director at the European headquarters, providing regular updates and aligning strategies.
4. Conduct technical evaluations, troubleshooting, and optimizations for semiconductor packaging applications.
5. Work alongside the R&D and production teams to enhance existing processes and develop new packaging technologies.
6. Stay updated with the latest advancements in semiconductor packaging and contribute to continuous improvement initiatives.
7. Assist in preparing technical documentation, specifications, and presentations for both internal and external stakeholders.

Requirements:

1. Bachelor’s degree in Microelectronics Packaging, Mechanical Engineering, Automation Engineering, or a related field.
2. Minimum of 3 years of experience in semiconductor packaging development or manufacturing, with a proven track record of successful project delivery.
3. In-depth knowledge of principles, methods, and processes for chip eutectic bonding, wafer bonding, and wire bonding (gold wire).
4. Proficiency in using AutoCAD and other computer-aided design tools for packaging design and documentation.
5. Strong understanding of thermal conductivity properties and their applications in semiconductor devices.
6. Fluent in English, both written and spoken, for effective communication within the global team and with international clients.
7. Excellent problem-solving skills and a proactive attitude towards troubleshooting and continuous improvement.
8. Ability to work independently as well as collaboratively in a fast-paced, international environment.