A Global Leading Company from Europe with Products of Semiconductor Packaing Equipment
The hiring company is a global leader in the development and production of energy-efficient manufacturing equipment for the electronics and photovoltaics industries. with a history of about 40 years, and headquartered in Europe, the company has established itself as a technological and innovation leader in the field of thermal processing, specifically for module production. The company operates a global network, coordinating activities from its European headquarters with 26 representations across 24 countries. and in China, it has 2 manufacturing bases respectively in Dongguan and East China
Title: Software Engineering Manager (Semiconductor packing equipment)
Subordinates: 5 engineers
Report to: COO (from Europe)
Location: Dongguan
Position Overview: Lead the end-to-end technology transfer of semiconductor packing equipment core software from Germany HQ to Dongguan, covering temperature control algorithms, MES integration, equipment communication, and PLC/HMI/SCADA software. Build and grow a fully independent software team in China within 1–2 years.
Key Responsibilities:
1. Team Building & Management
• Scale from a support-focused team to a full-stack local software team through strategic hiring and mentoring.
• Establish local development standards, CI/CD pipelines (GitHub), and code quality systems in Dongguan.
2. Stakeholder Alignment
• Act as the technical bridge between German software team, Dongguan plant management, product owners, and business stakeholders.
• Align business goals with technical execution; manage expectations across stakeholders; regularly communicate progress, risks, and technical decisions.
• Translate complex technical issues into clear language to support cross-functional decision-making and resource alignment.
3.Software-Hardware Integration
• Oversee temperature control algorithms, recipe management, MES integration (SECS/GEM/OPC UA), equipment communication, and Industry 4.0 applications.
• Support on-site software commissioning for oven profile optimization, remote diagnostics, and production line integration.
4.Technology Transfer & Localization
• Take over existing software assets (.NET/C#/C++, Visual Studio) from HQ; lead code reviews and knowledge transfer.
• Plan and execute Germany training program to enable independent development and maintenance in China.
Core Requirements:
• 5+ years of industrial equipment software development, 2+ years in technical team management.
• Expert in C#, VB, NET Framework/Core, proficient in C++, hands-on with Visual Studio.
• Familiar with industrial communication protocols (e.g., OPC-UA, MOTT, Ethernet/IP); experience with PLC/ HMI/ MES integration.
• Experience with GitHub Actions CI/CD.
• Mandarin and English working proficiency (must communicate technically with German HQ and drive cross-cultural alignment).
• Willing to travel to Germany for training and accept occasionally travel.
Preferred:
• Experience in SMT equipment software development (semiconductor packing equipment, wave solder, pick-and-place, etc.), familiar with semiconductor packing equipment process control logic.
• Knowledge of PID control, temperature compensation algorithms, and thermal modeling.
• German language proficiency.
Background information for reference:
Current:
• Always develop with the newest version of Visual Studio (VS 2022 prof. version)
• Modules .NET C# and C++ are most important for installation
• List of plugins and extensions for Visual Studio will be changed as often add or deleted items
Future:
• Work in China for 1–1.5 years to understand our business/company/software
• Go to German HQ to learn their structure & programming way
• Come back to China to integrate fully independent software department
要申请此工作 请将您的详细情况发送到以下邮箱 ben.lee@1314hr.com
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